The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Oct. 13, 2011
Applicants:
Hui-min Wu, Zhubei, TW;
Ming-i Wang, New Taipei, TW;
Kuan-yu Wang, New Taipei, TW;
Kun-che Hsieh, Tainan, TW;
Chien-hsin Huang, Taichung, TW;
Inventors:
Hui-Min Wu, Zhubei, TW;
Ming-I Wang, New Taipei, TW;
Kuan-Yu Wang, New Taipei, TW;
Kun-Che Hsieh, Tainan, TW;
Chien-Hsin Huang, Taichung, TW;
Assignee:
United Microelectronics Corporation, Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bond pad structure comprises an interconnection structure and an isolation layer. The dielectric layer has an opening and a metal pad. The isolation layer is disposed on the interconnection structure and extends into the opening until it is in contact with the metal pad, whereby the sidewalls of the opening is blanketed by the isolation layer, and a portion of the metal pad is exposed from the opening.