The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Jun. 18, 2014
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Bang-Chiang Lan, Taipei, TW;

Ming-I Wang, New Taipei, TW;

Li-Hsun Ho, Hsinchu County, TW;

Hui-Min Wu, Hsinchu County, TW;

Min Chen, New Taipei, TW;

Chien-Hsin Huang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 7/00 (2006.01); B81B 3/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01); H04R 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); H04R 3/00 (2013.01); H04R 7/00 (2013.01); H04R 19/005 (2013.01); H04R 31/00 (2013.01); B81B 2201/0271 (2013.01); H04R 2499/11 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate.


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