The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Sep. 19, 2008
Applicants:

Bang-chiang Lan, Taipei, TW;

Ming-i Wang, Taipei County, TW;

Li-hsun Ho, Hsinchu County, TW;

Hui-min Wu, Changhua County, TW;

Min Chen, Taipei County, TW;

Chien-hsin Huang, Taichung, TW;

Inventors:

Bang-Chiang Lan, Taipei, TW;

Ming-I Wang, Taipei County, TW;

Li-Hsun Ho, Hsinchu County, TW;

Hui-Min Wu, Changhua County, TW;

Min Chen, Taipei County, TW;

Chien-Hsin Huang, Taichung, TW;

Assignee:

United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure of a micro-electro-mechanical systems (MEMS) electroacoustic transducer includes a substrate, a diaphragm, a silicon material layer, and a conductive pattern. The substrate includes an MEMS device region. The diaphragm has openings, and is disposed in the MEMS device region. A first cavity is formed between the diaphragm and the substrate. The silicon material layer is disposed on the diaphragm and seals the diaphragm. The conductive pattern is disposed beneath the diaphragm in the MEMS device region.


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