The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Feb. 03, 2010
Chien-hsin Huang, Taichung, TW;
Bang-chiang Lan, Taipei, TW;
Hui-min Wu, Hsinchu County, TW;
Tzung-i Su, Yun-Lin County, TW;
Chao-an Su, Kaohsiung County, TW;
Tzung-han Tan, Taipei, TW;
Chien-Hsin Huang, Taichung, TW;
Bang-Chiang Lan, Taipei, TW;
Hui-Min Wu, Hsinchu County, TW;
Tzung-I Su, Yun-Lin County, TW;
Chao-An Su, Kaohsiung County, TW;
Tzung-Han Tan, Taipei, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A method of fabricating a MEMS microphone includes: first providing a substrate having a first surface and a second surface. The substrate is divided into a logic region and a MEMS region. The first surface of the substrate is etched to form a plurality of first trenches in the MEMS region. An STI material is then formed in the plurality of first trenches. Subsequently, the second surface of the substrate is etched to form a second trench in the MEMS region, wherein the second trench connects with each of the first trenches. Finally, the STI material in the first trenches is removed.