Tung-Hsing Lee

This inventor holds 30 USPTO granted patents and 23 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, United Microelectronics Corp.. Active years: 2007-2026.

USPTO Granted Patents = 30 (Patent Applications = 23)

% Patents Active = 100.0

EPO Patents = 2 (Patent Applications = 2)

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 97(Granted Patents)

Location History:

Taitung, TW (2007)
Hsin-Chu, TW (2007 - 2011)
Taipei Hsien, TW (2011)
Taipei County, TW (2009 - 2014)
Lujhou, TW (2014 - 2016)
Lujhou, New Taipei, TW (2017)
New Taipei, TW (2014 - 2018)

Company Filing History:

United Microelectronics Corp.

patents

Years Active: 2007-2026

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Areas of Expertise:

Cross-Die Interconnection

Dynamic Voltage Stress

Semiconductor Package

Integrated Circuit

Radio-Frequency Device

Passive Device Cell

Seal Ring Structure

Lateral Bipolar Junction Transistor

Integrated Inductor

Fabrication Process

Testkey Design Pattern

SiGe Device

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12645620 - Cross-die interconnection monitor method and cross-die interconnection monitor system capable of extracting cross-die interconnection data for multi-die packages (2026-06-02),

2. 12480987 - Dynamic voltage stress condition optimization method and dynamic voltage stress condition optimization system capable of performing block-based dynamic voltage stress wafer testing process (2025-11-25),

3. 9899261 - Semiconductor package structure and method for forming the same (2018-02-20),

4. 9859356 - Semiconductor integrated circuit (2018-01-02),

5. 9786560 - Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same (2017-10-10),

6. 9712130 - Passive device cell and fabrication process thereof (2017-07-18),

7. 9640489 - Seal ring structure with capacitor (2017-05-02),

8. 9620640 - Body-contact metal-oxide-semiconductor field effect transistor device (2017-04-11),

9. 9607894 - Radio-frequency device package and method for fabricating the same (2017-03-28),

10. 9543232 - Semiconductor package structure and method for forming the same (2017-01-10),

11. 9425098 - Radio-frequency device package and method for fabricating the same (2016-08-23),

12. 9373727 - Semiconductor diode (2016-06-21),

13. 9324705 - Lateral bipolar junction transistor (2016-04-26),

14. 9190976 - Passive device cell and fabrication process thereof (2015-11-17),

15. 8987851 - Radio-frequency device package and method for fabricating the same (2015-03-24),

Title: Tung-Hsing Lee: Pioneering Inventor from New Taipei

Introduction: Tung-Hsing Lee is a renowned inventor hailing from New Taipei, Taiwan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Lee holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative spirit and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Tung-Hsing Lee has worked with leading tech companies, research institutions, and universities, playing a key role in developing cutting-edge technologies that have revolutionized industries.

Collaborations: Throughout his career, Lee has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Tung-Hsing Lee's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and visionaries worldwide.