Dynamic voltage stress condition optimization method and dynamic voltage stress condition optimization system capable of performing block-based dynamic voltage stress wafer testing process

Abstract

A dynamic voltage stress (DVS) condition optimization includes selecting a testing block from a plurality of blocks in a die of a wafer, acquiring a plurality of testing block measurement temperatures of the testing block when the testing block is processed by a DVS testing flow, acquiring a correlation table of the plurality of testing block measurement temperatures and a plurality of DVS block predict temperatures of the testing block, configuring a tip burnt block temperature according to the testing block measurement temperatures, determining a DVS block target temperature selected from the DVS block predict temperatures according to the correlation table and the tip burnt block temperature, and generating a DVS block voltage for applying to the testing block in the die of the wafer according to the DVS block target temperature.