The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Nov. 14, 2024
Applicant:
Mediatek Inc., Hsinchu City, TW;
Inventors:
PO-Chao Tsao, Hsinchu City, TW;
Tung-Hsing Lee, Hsinchu City, TW;
Assignee:
MEDIATEK INC., Hsinchu City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/20 (2006.01);
U.S. Cl.
CPC ...
G06F 13/20 (2013.01); G06F 2213/40 (2013.01);
Abstract
A cross-die interconnection monitor method includes providing a first die and a second die, embedding an intra-die detector into the first die for detecting a first feature of the first die, allocating a first inter-die detector from the first die to the second die for detecting a second feature between the first die and the second die, and comparing the first feature with the second feature for generating cross-die interconnect data from the first die to the second die by a neural network.