The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Jan. 21, 2015
Mediatek Inc., Hsin-Chu, TW;
Cheng-Chou Hung, Hukou Township, Hsinchu County, TW;
Ming-Tzong Yang, Baoshan Township, Hsinchu County, TW;
Tung-Hsing Lee, New Taipei, TW;
Wei-Che Huang, Zhudong Township, Hsinchu County, TW;
Yu-Hua Huang, Hsinchu, TW;
Tzu-Hung Lin, Zhubei, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
A semiconductor package structure and method for forming the same are provided. The semiconductor package structure includes a substrate and the substrate has a front side and a back side. The semiconductor package structure includes a through silicon via (TSV) interconnect structure formed in the substrate; and a first guard ring doped region and a second guard ring doped region formed in the substrate, and the first guard ring doped region and the second guard ring doped region are adjacent to the TSV interconnect structure.