Ming-Tzong Yang

This inventor holds 35 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Mediatek Corporation, Other. Active years: 2010-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Tzong Yang. Retrieved from https://idiyas.com/inventor/ming-tzong-yang-wqb5l663

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 35

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 97(Granted Patents)

Location History:

Hsinchu County, TW (2010 - 2020)
Baoshan Township, Hsinchu County, TW (2014 - 2020)
Baoshan Township, TW (2022)
Hsinchu, TW (2013 - 2023)

Company Filing History:

35 out of 5,127

Mediatek Corporation

patents

1 out of 834,601

Other

patents

where one patent can have more than one assignee

Years Active: 2010-2023

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Areas of Expertise:

Semiconductor Device

Thermal Via Arrangement

System-On-Chip

Through Silicon Via

Radio-Frequency Package

Passive Device Cell

High-Voltage MOS

Integrated Inductor

Seal Ring Structure

Bump Pad Structure

Lateral Bipolar Junction Transistor

ESD Protection Device

35 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11587846 - Semiconductor device and method of forming the same (2023-02-21),

2. 11348900 - Package structure (2022-05-31),

3. 10741469 - Thermal via arrangement for multi-channel semiconductor device (2020-08-11),

4. 10727202 - Package structure (2020-07-28),

5. 10361173 - Semiconductor package assemblies with system-on-chip (SOC) packages (2019-07-23),

6. 10332830 - Semiconductor package assembly (2019-06-25),

7. 9947624 - Semiconductor package assembly with through silicon via interconnect (2018-04-17),

8. 9899261 - Semiconductor package structure and method for forming the same (2018-02-20),

9. 9870980 - Semiconductor package with through silicon via interconnect (2018-01-16),

10. 9859192 - Semiconductor structure with through-silicon via (2018-01-02),

11. 9786560 - Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same (2017-10-10),

12. 9712130 - Passive device cell and fabrication process thereof (2017-07-18),

13. 9679842 - Semiconductor package assembly (2017-06-13),

14. 9640489 - Seal ring structure with capacitor (2017-05-02),

15. 9607894 - Radio-frequency device package and method for fabricating the same (2017-03-28),

Title: The Innovative Journey of Ming-Tzong Yang

Introduction: Ming-Tzong Yang, a distinguished inventor hailing from Baoshan, CN, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Ming-Tzong Yang's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Ming-Tzong Yang has worked tirelessly to push the boundaries of technological innovation. His work has been recognized globally, earning him prestigious awards and accolades in the industry.

Collaborations: Ming-Tzong Yang has collaborated with leading research institutions and universities to further his research and bring his inventions to life. His partnerships have been instrumental in the successful implementation of his groundbreaking ideas.

Conclusion: Ming-Tzong Yang's passion for innovation and dedication to creating a sustainable future through technology make him a true pioneer in the field of inventions. His work continues to inspire and shape the future of technology worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]