The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Mar. 10, 2016
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Ming-Tzong Yang, Baoshan Township, Hsinchu County, TW;
Yu-Hua Huang, Hsinchu, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 23/48 (2006.01); H01L 27/02 (2006.01); H01L 27/092 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 27/0207 (2013.01); H01L 23/53295 (2013.01); H01L 27/092 (2013.01);
Abstract
A semiconductor structure includes a semiconductor substrate and a conductive element formed in a portion of the semiconductor substrate. The semiconductor structure further includes a plurality of insulating elements formed in portions of the semiconductor substrate at a first region surrounding the conductive element and a semiconductor device formed over a portion of the semiconductor substrate at a second region adjacent to the first region. The first region is formed between the conductive element and the second region.