The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Feb. 13, 2015
Mediatek Inc., Hsin-Chu, TW;
Ming-Tzong Yang, Baoshan Township, Hsinchu County, TW;
Cheng-Chou Hung, Hukou Township, Hsinchu County, TW;
Tung-Hsing Lee, Lujhou, New Taipei, TW;
Wei-Che Huang, Zhudong Township, Hsinchu County, TW;
Yu-Hua Huang, Hsinchu, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
An electronic device package has a base and an electronic device chip mounted on the base. The electronic device chip includes a semiconductor substrate having a front side and a back side, a electronic component disposed on the front side of the semiconductor substrate, an interconnect structure disposed on the electronic component, a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure, and a TSV structure disposed in the through hole. The interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure.