The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2017
Filed:
Jul. 01, 2014
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Cheng-Chou Hung, Hukou Township, Hsinchu County, TW;
Tung-Hsing Lee, New Taipei, TW;
Yu-Hua Huang, Hsinchu, TW;
Ming-Tzong Yang, Baoshan Township, Hsinchu County, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 29/94 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 27/0805 (2013.01); H01L 29/94 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate of a first conductivity type having a chip region enclosed by a seal ring region. An insulating layer is on the semiconductor substrate. A seal ring structure is embedded in the insulating layer corresponding to the seal ring region. And, a plurality of doping regions are located beneath the first seal ring structure.