The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2016

Filed:

Jun. 24, 2011
Applicants:

Ming-tzong Yang, Baoshan Township, Hsinchu County, TW;

Tung-hsing Lee, Lujhou, TW;

Inventors:

Ming-Tzong Yang, Baoshan Township, Hsinchu County, TW;

Tung-Hsing Lee, Lujhou, TW;

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 29/861 (2006.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/861 (2013.01); H01L 29/417 (2013.01); H01L 29/45 (2013.01);
Abstract

A semiconductor diode includes a semiconductor substrate having a lightly doped region with a first conductivity type therein. A first heavily doped region with a second conductivity type opposite to the first conductivity type is in the lightly doped region. A second heavily doped region with the first conductivity type is in the lightly doped region and is in direct contact with the first heavily doped region. A first metal silicide layer is on the semiconductor substrate and is in direct contact with the first heavily doped region. A second metal silicide layer is on the semiconductor substrate and is in direct contact with the second heavily doped region. The second metal silicide layer is spaced apart from the first metal silicide layer.


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