Tien-Chung Yang

This inventor holds 24 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tien-Chung Yang. Retrieved from https://idiyas.com/inventor/tien-chung-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 24 (Patent Applications = 7)

% Patents Active = 91.7

Average Co-Inventor Count = 4.9

ph-index = 5

Forward Citations = 143(Granted Patents)

Location History:

San Jose, CA (US) (2012)
Hsin-Chu, TW (2017 - 2023)

Company Filing History:

24 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2012-2025

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Areas of Expertise:

Semiconductor Device

Package Structures

Manufacturing Method

Wafer Level Shielding

Multi-Stack Structures

EMI Protection

Cascaded Openings

Fan-Out Packages

Redistribution Structure

Pop Devices

Crack Reduction

Electromagnetic Interference

24 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12482763 - Semiconductor device package and methods of formation (2025-11-25),

2. 12476178 - Reduction of cracks in redistribution structure (2025-11-18),

3. 12469807 - Fan-out package structures with cascaded openings in enhancement layer (2025-11-11),

4. 12243833 - Semiconductor device with electromagnetic interference film and method of manufacture (2025-03-04),

5. 11842983 - Semiconductor structure (2023-12-12),

6. 11177238 - Semiconductor structure (2021-11-16),

7. 11145633 - Semiconductor package and manufacturing method thereof (2021-10-12),

8. 11133197 - Semiconductor structure and method of forming (2021-09-28),

9. 10825780 - Semiconductor device with electromagnetic interference protection and method of manufacture (2020-11-03),

10. 10510715 - Semiconductor structure and manufacturing method thereof (2019-12-17),

11. 10340155 - Semiconductor structure and method of forming (2019-07-02),

12. 10276542 - Package structure and manufacturing method thereof (2019-04-30),

13. 10217687 - Semiconductor device and manufacturing method thereof (2019-02-26),

14. 10163701 - Multi-stack package-on-package structures (2018-12-25),

15. 10090284 - Semiconductor device and method of manufacture (2018-10-02),

Title: The Innovative Journey of Inventor Tien-Chung Yang

Introduction: Tien-Chung Yang, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Tien-Chung Yang's latest patents include advancements in semiconductor technology, renewable energy solutions, and artificial intelligence systems, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Tien-Chung Yang has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patents and products.

Collaborations: Throughout his career, Tien-Chung Yang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing that has led to groundbreaking inventions.

Conclusion: Tien-Chung Yang's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

7 patents pending: