The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Mar. 16, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Tien-Chung Yang, Hsinchu, TW;
Lin-Chih Huang, Hsinchu, TW;
Hsien-Wei Chen, Hsinchu, TW;
An-Jhih Su, Taoyuan, TW;
Li-Hsien Huang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 23/485 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/485 (2013.01); H01L 23/4824 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 24/03 (2013.01); H01L 24/10 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/20 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 2021/60022 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/11466 (2013.01); H01L 2224/11602 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/94 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/18162 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate, a conductive pad over the semiconductor substrate, a conductor over the conductive pad, a polymeric material over the semiconductor substrate and surrounding the conductor, and a seed layer between the polymeric material and the conductor. A top surface of the conductor, a top surface of the polymeric material and a top surface of the seed layer are substantially coplanar.