Lin-Chih Huang

This inventor holds 18 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lin-Chih Huang. Retrieved from https://idiyas.com/inventor/lin-chih-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 18

% Patents Active = 83.3

Average Co-Inventor Count = 5.8

ph-index = 4

Forward Citations = 48(Granted Patents)

Location History:

Wuri Township, TW (2015 - 2016)
Hsin-Chu, TW (2017 - 2023)

Company Filing History:

18 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2015-2023

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Areas of Expertise:

Interconnect Structure

Through Via

Substrateless Integrated Circuit

Semiconductor Device

Chip On Wafer

CoWoS Formation

Manufacturing Method

Ultra-Thin Packaging

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11756883 - Through via structure and method (2023-09-12),

2. 11728296 - Interconnect structure and method of forming same (2023-08-15),

3. 10811374 - Interconnect structure and method of forming same (2020-10-20),

4. 10714423 - Through via structure and method (2020-07-14),

5. 10290604 - Substrateless integrated circuit packages and methods of forming same (2019-05-14),

6. 10217687 - Semiconductor device and manufacturing method thereof (2019-02-26),

7. 10157866 - Interconnect structure and method of forming same (2018-12-18),

8. 9953920 - Interconnect structure and method (2018-04-24),

9. 9929069 - Semiconductor device and manufacturing method thereof (2018-03-27),

10. 9842825 - Substrateless integrated circuit packages and methods of forming same (2017-12-12),

11. 9831177 - Through via structure (2017-11-28),

12. 9748190 - Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation (2017-08-29),

13. 9679859 - Interconnect structure and method of forming same (2017-06-13),

14. 9564345 - Semiconductor device and manufacturing method thereof (2017-02-07),

15. 9252110 - Interconnect structure and method of forming same (2016-02-02),

Title: The Innovative Journey of Inventor Lin-Chih Huang

Introduction:

Lin-Chih Huang, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology and innovation through his groundbreaking inventions and patents.

Latest Patents:

Lin-Chih Huang's latest patents include cutting-edge technologies in the fields of semiconductor devices, renewable energy systems, and advanced robotics. His innovative solutions have garnered international recognition for their ingenuity and practical applications.

Career Highlights:

With a career spanning over two decades, Lin-Chih Huang has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing novel solutions to address them. His work has revolutionized industries such as electronics, healthcare, and transportation, earning him a reputation as a trailblazer in the world of innovation.

Collaborations:

Throughout his career, Lin-Chih Huang has collaborated with leading research institutions, universities, and multinational corporations to bring his inventions to life. His ability to work effectively in multidisciplinary teams has led to the successful commercialization of several groundbreaking technologies, further solidifying his status as a prolific inventor.

Conclusion:

In conclusion, Lin-Chih Huang's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible have cemented his legacy as a visionary inventor. His contributions to the world of technology continue to inspire future generations of inventors and serve as a testament to the power of creativity and perseverance in driving meaningful change.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]