The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Aug. 18, 2015
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Tien-Chung Yang, Hsinchu, TW;
Lin-Chih Huang, Hsinchu, TW;
Hsien-Wei Chen, Hsinchu, TW;
An-Jhih Su, Taoyuan County, TW;
Li-Hsien Huang, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a conductor over the conductive pad. The semiconductor device further has a polymeric material disposed over the semiconductor substrate and surrounding the conductor. The semiconductor device also includes an electric conductive layer between the conductor and the polymeric material. In the semiconductor device, an adhesion strength between the electric conductive layer and the polymeric material is greater than an adhesion strength between the polymeric material and the conductor.