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Hsinchu, Taiwan

Tai-I Yang

USPTO Granted Patents = 87 (Patent Applications = 5)

Average Co-Inventor Count = 4.7

ph-index = 6

Forward Citations = 139(Granted Patents)

Forward Citations (Not Self Cited) = 128(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

83 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

Vanguard International Semiconductor Corporation

Fon Da Tech Co, Ltd

Years Active: 2015-2025

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Areas of Expertise:

Semiconductor Device

Interconnect Structure

Low-Resistance Interconnect

Gate All Around Device

Capacitive Biosensor

Nano-Electromechanical System

Magnetoresistive Devices

Multi-Metal Fill

Conductive Structures

Vertical MOS Transistor

Self-Aligned Conductive Features

Wafer Etching Apparatus

87 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12300600 - Semiconductor device with self-aligned conductive features (2025-05-13),

2. 12278143 - Method of providing a workpiece including low resistance interconnect low-resistance interconnect (2025-04-14),

3. 12230534 - Semiconductor device and method of manufacture (2025-02-18),

4. 12094946 - Gate all around device (2024-09-17),

5. 12062611 - Integrated circuit interconnect structures with air gaps (2024-08-13),

6. 12051646 - Metal line structure and method (2024-07-30),

7. 12002709 - Interconnect structure and manufacturing method for the same (2024-06-04),

8. 11988625 - Capacitive biosensor and fabricating method thereof (2024-05-21),

9. 11860550 - Multi-metal fill with self-aligned patterning and dielectric with voids (2024-01-02),

10. 11842962 - Interconnect structure with air-gaps (2023-12-12),

11. 11784627 - Lamb wave resonator and method of fabricating the same (2023-10-10),

12. 11769695 - Semiconductor structure including low-resistance interconnect and integrated circuit device having the same (2023-09-26),

13. 11764106 - Semiconductor device and method of manufacture (2023-09-19),

14. 11640924 - Structure and method for interconnection with self-alignment (2023-05-02),

15. 11495539 - Interconnect structure with air-gaps (2022-11-08),

Title: The Innovative Journey of Inventor Tai-I Yang

Introduction: Tai-I Yang is a pioneering inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tai-I Yang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Tai-I Yang has worked with leading tech companies and research institutions, spearheading projects that have pushed the boundaries of what is possible in the realm of innovation.

Collaborations: Throughout his career, Tai-I Yang has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of creativity and excellence in all his endeavors.

Conclusion: In conclusion, Tai-I Yang stands as a shining example of an inventor whose passion for innovation, coupled with his technical expertise, has led to the creation of groundbreaking technologies that have the potential to shape the future of various industries.

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