Taipei, Taiwan

Cheng-Chin Lee

This inventor holds 64 USPTO granted patents and 42 published patent applications, primarily in Semiconductor Interconnects. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2020-2026.

USPTO Granted Patents = 64 

% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 4

Forward Citations = 37(Granted Patents)

Forward Citations (Not Self Cited) = 10(Dec 10, 2025)


Location History:

  • Taipei, TW (2020 - 2024)
  • Hsinchu, TW (2021 - 2024)

Company Filing History:


Years Active: 2020-2026

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Areas of Expertise:
Interconnect Structure
Thermal Management
Air Gap Structures
Low-Capacitance
Selective Deposition
Self-Aligned Conductive Structure
Dielectric Layer
Metallization Layer
Conductive Feature
Resistor Device
Heat Dissipation
64 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Cheng-Chin Lee in Semiconductor Patents

Introduction

Cheng-Chin Lee is a prolific inventor based in Taipei, Taiwan, known for his remarkable contributions to the field of semiconductor technology. With a total of 40 patents to his name, his work has significantly advanced the capabilities and efficiencies of semiconductor devices.

Latest Patents

Among his latest patents, one noteworthy invention is a "Semiconductor device structure having air gap and methods of forming the same." This method improves interconnect structures by involving a detailed process of forming conductive layers, sacrificial layers, and ultimately creating air gaps that enhance device performance. Additionally, he has developed a "Dielectric capping structure overlying a conductive structure to increase stability." This patent focuses on the integration of dielectric layers that align precisely with conductive structures, increasing the stability of integrated chips.

Career Highlights

Cheng-Chin Lee has played a pivotal role at Taiwan Semiconductor Manufacturing Company Limited, where his work has paved the way for advancements in the semiconductor industry. His cutting-edge research not only addresses current technological challenges but also sets a foundation for future innovations in chip design and fabrication processes.

Collaborations

Throughout his career, Cheng-Chin has collaborated with esteemed colleagues such as Hsin-Yen Huang and Shao-Kuan Lee. These partnerships within the semiconductor field have contributed to the successful development of various patented technologies and innovations that continue to impact the industry positively.

Conclusion

In conclusion, Cheng-Chin Lee's extensive portfolio of patents and his commitment to innovation in semiconductor technology make him a key figure in the field. His work not only enhances the performance of contemporary devices but also sets the stage for future breakthroughs in semiconductor applications.

Profile summary based on public USPTO records.
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