Tadatomo Suga

This inventor holds 26 USPTO granted patents and 3 published patent applications and 5 EPO patents. Top assignees: Bondtech Co., Ltd., Tadatomo Suga, Tokyo Electron Limited. Active years: 2002-2025.

USPTO Granted Patents = 26 (Patent Applications = 3)

% Patents Active = 80.8

EPO Patents = 5 (Patent Applications = 6)

Average Co-Inventor Count = 2.4

ph-index = 7

Forward Citations = 973(Granted Patents)

Location History:

Meguro-ku, Tokyo, JP (2006 - 2007)
Yamaguchi-ken, JP (2007)
Tokyo, JP (2002 - 2023)

Company Filing History:

Tokyo Electron Limited

Alpha Design Co., Ltd.

patents

6. 2 out of 8

Lan Technical Service Co., Ltd.

Isabers Japan Co. Ltd.

Renesas Technology Corp.

patents

12. 1 out of 338

Senju Metal Industry Co., Ltd.

patents

13. 1 out of 1,769

Taiyo Yuden Co., Ltd.

15. 16 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 2002-2025

Loading Chart...

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12409644 - Substrate bonding method and substrate bonding system (2025-09-09),

2. 12388045 - Bonding system and bonding method (2025-08-12),

3. 12275670 - Method for joining transparent substrates (2025-04-14),

4. 12261147 - Bonding system and bonding method (2025-03-25),

5. 11849566 - Joint structure, electronic device and method for manufacturing the joint structure (2023-12-19),

6. 11837444 - Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device (2023-12-05),

7. 10204785 - Substrate bonding apparatus and substrate bonding method (2019-02-12),

8. 10166749 - Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly (2019-01-01),

9. 9870922 - Substrate bonding apparatus and substrate bonding method (2018-01-16),

10. 9601350 - Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly (2017-03-21),

11. 8915418 - Electronic component bonding method (2014-12-23),

12. 8875977 - Element pressing apparatus and heating system using element pressing apparatus (2014-11-04),

13. 8651363 - Joining method and device produced by this method and joining unit (2014-02-18),

14. 8091764 - Joining method and device produced by this method and joining unit (2012-01-10),

15. 7784670 - Joining method and device produced by this method and joining unit (2010-08-31),

Title: Tadatomo Suga - Pioneering Inventor from Tokyo

Introduction: Tadatomo Suga is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tadatomo Suga holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Suga has worked with leading research institutions and tech companies in Japan, spearheading projects that have revolutionized various industries.

Collaborations: Throughout his career, Tadatomo Suga has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence in all his projects.

Conclusion: Tadatomo Suga's relentless pursuit of innovation and his passion for creating solutions to complex problems have solidified his reputation as a visionary inventor in Tokyo and beyond.