The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2023
Filed:
Nov. 06, 2017
Bondtech Co., Ltd., Kyoto, JP;
Tadatomo Suga, Tokyo, JP;
Akira Yamauchi, Kyoto, JP;
Tadatomo Suga, Tokyo, JP;
Other;
BONDTECH CO., LTD., Kyoto, JP;
Abstract
The substrate joining method is a substrate joining method for joying two substrates, including a hydrophilic treatment step of hydrophilizing at least one of respective joint surfaces of the two substrates that are to be joined to each other and a joining step of joining the two substrates after the hydrophilic treatment step. The hydrophilic treatment step includes a step of performing a NRIE treatment to perform reactive ion etching using Ngas on the joint surfaces of the substrates and a step of performing a Nradical treatment to irradiate the joint surfaces of the substrates with Nradicals after the step of performing the NRIE treatment.