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Bondtech Co., Ltd.

USPTO Granted Patents = 15

EPO Patents = 3

Trademarks = 1

Forward Citations = 47

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5 inventors (with patents filed for the assignee):

Akira Yamauchi (15 out of 45 patents)

Tadatomo Suga (7 out of 26 patents)

Ryuichi Kondou (1 out of 7 patents)

4. Yoshiie Matsumoto (1 out of 10 patents)

5. Tadatomo Suga (1 out of 7 patents)

6. Tomoyuki Ayumi Industry Co Ltd Abe (0 patent)

7. Taehyun F209 Mitaka Int Hall Of Residence Kim (0 patent)

15 patents: Sort by Forward Citations

1. 12409644 - Substrate bonding method and substrate bonding system (2025-09-09),

2. 12388045 - Bonding system and bonding method (2025-08-12),

3. 12341036 - Resin shaping device (2025-06-24),

4. 12261147 - Bonding system and bonding method (2025-03-25),

5. 12261070 - Component mounting system and component mounting method (2025-03-25),

6. 12094747 - Substrate bonding device (2024-09-17),

7. 11837444 - Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device (2023-12-05),

8. 11587804 - Component mounting system (2023-02-21),

9. 10580752 - Method for bonding substrates together, and substrate bonding device (2020-03-03),

10. 10204785 - Substrate bonding apparatus and substrate bonding method (2019-02-12),

11. 9870922 - Substrate bonding apparatus and substrate bonding method (2018-01-16),

12. 9601350 - Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly (2017-03-21),

13. 9379082 - Pressure application apparatus and pressure application method (2016-06-28),

14. 9243894 - Pressure application apparatus and pressure application method (2016-01-26),

15. 9142532 - Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer (2015-09-22),

BONDTECH CO., LTD. is a leading global manufacturer of industrial machinery and equipment. With over 20 years of experience, we specialize in the design, development, and production of innovative solutions for various industries, including recycling, waste management, and renewable energy. Our cutting-edge technology and superior quality products have gained us recognition and trust from clients worldwide. Visit our website to learn more about our comprehensive range of solutions and how we can help your business succeed.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

15 Patents

#82 in Kyoto 615-0031

#3,367 in Japan

#38,696 in the World

Bondtech Co., Ltd.

Forward Citations = 47

5 inventors:

Akira Yamauchi (15 out of 45 patents)

Tadatomo Suga (7 out of 26 patents)

Ryuichi Kondou (1 out of 7 patents)

4. Yoshiie Matsumoto (1 out of 10 patents)

5. Tadatomo Suga (1 out of 7 patents)

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