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For the Inventor, By the Inventor

Kyoto, Japan

Bondtech Co., Ltd.


USPTO Granted Patents = 15


Forward Citations = 57

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5 inventors (with patents filed for the assignee):

goldMedal Akira Yamauchi (15 out of 46 patents)

silverMedal Tadatomo Suga (7 out of 26 patents)

bronzeMedal Ryuichi Kondou (1 out of 7 patents)

4.  Yoshiie Matsumoto (1 out of 10 patents)

5.  Tadatomo Suga (1 out of 7 patents)

6.  Tomoyuki Ayumi Industry Co Ltd Abe (0 patent)

7.  Taehyun F209 Mitaka Int Hall Of Residence Kim (0 patent)


15 patents:

1. 12409644 - Substrate bonding method and substrate bonding system (2025-09-09),
2. 12388045 - Bonding system and bonding method (2025-08-12),
3. 12341036 - Resin shaping device (2025-06-24),
4. 12261147 - Bonding system and bonding method (2025-03-25),
5. 12261070 - Component mounting system and component mounting method (2025-03-25),
6. 12094747 - Substrate bonding device (2024-09-17),
7. 11837444 - Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device (2023-12-05),
8. 11587804 - Component mounting system (2023-02-21),
9. 10580752 - Method for bonding substrates together, and substrate bonding device (2020-03-03),
10. 10204785 - Substrate bonding apparatus and substrate bonding method (2019-02-12),
11. 9870922 - Substrate bonding apparatus and substrate bonding method (2018-01-16),
12. 9601350 - Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly (2017-03-21),
13. 9379082 - Pressure application apparatus and pressure application method (2016-06-28),
14. 9243894 - Pressure application apparatus and pressure application method (2016-01-26),
15. 9142532 - Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer (2015-09-22),
Company Overview
Bondtech Co., Ltd., based in Kyoto, Japan, specializes in advanced bonding technologies and materials. The company focuses on developing innovative solutions for various industries, including electronics, automotive, and medical devices. Bondtech is dedicated to enhancing product performance and reliability through its cutting-edge research in adhesive technologies and surface treatments. With a commitment to quality and innovation, Bondtech aims to meet the evolving needs of its global clientele.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

Bondtech Co., Ltd. USPTO Patent Assignee Logo
15 Patents

#104 in Kyoto 615-0031

#3,447 in Japan

#39,959 in the World

Kyoto, JP
Kyoto, Japan

Bondtech Co., Ltd.

Forward Citations = 57

5 inventors:

goldMedal Akira Yamauchi (15 out of 46 patents)

silverMedal Tadatomo Suga (7 out of 26 patents)

bronzeMedal Ryuichi Kondou (1 out of 7 patents)

4.  Yoshiie Matsumoto (1 out of 10 patents)

5.  Tadatomo Suga (1 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bondtech Co., Ltd.. Retrieved from https://idiyas.com/company/bondtech-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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