The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Jan. 31, 2018
Applicant:
Bondtech Co., Ltd., Kyoto, JP;
Inventor:
Akira Yamauchi, Kyoto, JP;
Assignee:
BONDTECH CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B29C 35/08 (2006.01); B29C 45/14 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H05K 13/04 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); B29C 35/0805 (2013.01); B29C 45/14065 (2013.01); B29C 45/14655 (2013.01); H01L 21/02057 (2013.01); H01L 21/565 (2013.01); H01L 21/6715 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67098 (2013.01); H01L 21/67259 (2013.01); H01L 21/67742 (2013.01); H01L 21/681 (2013.01); H01L 21/6838 (2013.01); H01L 22/12 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H05K 13/0413 (2013.01); B29C 2035/0827 (2013.01); B29L 2031/3406 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75843 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81908 (2013.01); H05K 13/0409 (2018.08);
Abstract
A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.