Shiga, Japan

Akira Yamauchi

This inventor holds 46 USPTO granted patents and 6 published patent applications and 2 EPO patents, primarily in Substrate Bonding. Top assignees: Bondtech Co., Ltd., Kabushiki Kaisha Toshiba, Toray Engineering Company, Limited. Active years: 1976-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Yamauchi. Retrieved from https://idiyas.com/inventor/akira-yamauchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 46 

% Patents Active = 78.3

 

Average Co-Inventor Count = 1.7

ph-index = 9

Forward Citations = 388(Granted Patents)


Location History:

  • Taki, Hyogo, JA (1976)
  • Takigun, Hyogo Prefecture, JP (1979)
  • Amagasaki, JP (1980)
  • Otsu, JP (2003)
  • Shiga, JP (2004 - 2011)
  • Uji, JP (2015 - 2016)
  • Yokohama, JP (1997 - 2017)
  • Yokohama Kanagawa, JP (2020 - 2022)
  • Kyoto, JP (2016 - 2023)

Company Filing History:


Years Active: 1976-2026

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Areas of Expertise:
Substrate Bonding
Component Mounting
Power Amplifying
Resin Shaping
Current Feedback Circuit
Calibration Method
Pressure Application
Chip Mounting
Thermo-Compression Bonding
Integrated Circuit
PWM Modulator
Audio System
46 patents (USPTO):Explore Patents

Title: Akira Yamauchi: Innovator in Substrate Technology

Introduction

Akira Yamauchi is a prominent inventor based in Shiga, Japan, known for his substantial contributions to substrate technology. With a remarkable portfolio of 38 patents, his work focuses on enhancing the efficiency and effectiveness of substrate bonding and joining processes.

Latest Patents

One of Yamauchi's latest patents is a substrate bonding device that features an innovative design comprising a stage, a head, an electrostatic chuck, a holder driver, and a controller. This device effectively holds a substrate while facilitating precise control during the bonding process. The electrostatic chuck is strategically positioned to enhance stability, allowing for efficient release once alignment is achieved.

Additionally, his patent on a substrate joining method incorporates a hydrophilic treatment step to improve adhesive bond strength between two substrates. This process includes reactive ion etching and the application of Nradicals, significantly enhancing the bonding surface preparation for optimal joining outcomes.

Career Highlights

Yamauchi has made significant strides in his career, having worked with industry-leading companies such as Toray Engineering Company, Limited and Toshiba Corporation. His innovative contributions have played a pivotal role in advancing technologies related to substrate bonding and joining processes.

Collaborations

Throughout his career, Yamauchi has collaborated with notable individuals, including Hiroyuki Tsurumi and Yoshiyuki Arai. These partnerships have fostered a collaborative environment that has further spurred innovation and advancements in their respective fields.

Conclusion

Akira Yamauchi stands out as a notable inventor in substrate technology, with a substantial number of patents that reflect his commitment to innovation. His work not only demonstrates his expertise but also contributes to the ongoing evolution of substrate bonding methods, paving the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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