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Toray Engineering Company, Limited

USPTO Granted Patents = 105

% Expired Patents = 39.0

EPO Patents = 9

Trademarks = 3

Forward Citations = 341

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166 inventors (with patents filed for the assignee):

Takashi Iwade (22 out of 23 patents)

Akira Yamauchi (14 out of 46 patents)

Jun Takagi (9 out of 9 patents)

4. Chisa Inaka (8 out of 9 patents)

5. Yoshiyuki Arai (8 out of 8 patents)

6. Masanori Akita (8 out of 11 patents)

7. Masamichi Yamashita (7 out of 7 patents)

8. Katsumi Terada (7 out of 7 patents)

9. Yoshiro Migaki (6 out of 6 patents)

10. Takayoshi Fujimoto (5 out of 5 patents)

11. Masaki Mori (4 out of 4 patents)

12. Toshihiro Mori (4 out of 80 patents)

13. Toyoharu Terada (4 out of 4 patents)

14. Jun Inagaki (3 out of 22 patents)

15. Tsukasa Niwa (3 out of 3 patents)

Core Competencies:

Chip Mounting Device

Alignment Method

Semiconductor Device

Three-Dimensional Mounting

Resin Molded Articles

Inspection Device

Solar Cell Module

Chemical Synthesis Device

Film Thickness Measurement

Non-Contact ID Card

Thin-Film Forming

Forceps System

105 patents: Sort by Forward Citations

1. 12347803 - Mounting device and mounting method (2025-07-01),

2. 12154811 - Mounting device and mounting method (2024-11-26),

3. 11823938 - Mounting device and mounting method (2023-11-21),

4. 11667092 - Sheet metal member forming method and sheet metal member forming device (2023-06-06),

5. 11651124 - Anti-warping design method for resin molded article, recording medium, and anti-warping design device for resin molded article (2023-05-16),

6. 11607871 - Partition wall for formation of lipid bilayer membrane, and method for producing same (2023-03-21),

7. 11508950 - Electrode sheet manufacturing method and electrode sheet manufacturing apparatus (2022-11-22),

8. 11504686 - Synthesis device and measuring mechanism (2022-11-22),

9. 11495571 - Mounting method and mounting device (2022-11-08),

10. 11465356 - Method for predicting strength of structure, method for modeling structure, support method for additive manufacturing of structure, and recording medium (2022-10-11),

11. 11416655 - Analysis mesh generation method, recording medium, and analysis mesh generation device (2022-08-16),

12. 11409164 - Light conversion member (2022-08-09),

13. 11390018 - Three-dimensional modeling method (2022-07-19),

14. 10981133 - Chemical synthesis device (2021-04-20),

15. 10874785 - Component concentration sensing system (2020-12-29),

Company Overview

Toray Engineering Company, Limited, based in Osaka, Japan, specializes in advanced chip mounting technology, focusing on the development and manufacturing of innovative devices and methods for semiconductor applications. The company is recognized for its expertise in alignment methods, three-dimensional mounting, and inspection devices, contributing significantly to the efficiency and precision of semiconductor production. Additionally, Toray Engineering is involved in the creation of resin molded articles and solar cell modules, showcasing its diverse technological capabilities.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

105 Patents

#120 in Osaka

#1,088 in Japan

#7,466 in the World

Toray Engineering Company, Limited

Forward Citations = 341

166 inventors:

Takashi Iwade (22 out of 23 patents)

Akira Yamauchi (14 out of 46 patents)

Jun Takagi (9 out of 9 patents)

4. Chisa Inaka (8 out of 9 patents)

5. Yoshiyuki Arai (8 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Toray Engineering Company, Limited. Retrieved from https://idiyas.com/company/toray-engineering-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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