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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11495571 B1

PDFFull Text
Date of Patent:
Nov. 08, 2022

Filed:

Aug. 23, 2017

Mounting method and mounting device

Applicant:

Toray Engineering Co., Ltd., Tokyo, JP;

Inventor:

Yoshiyuki Arai, Otsu, JP;

Assignee:

TORAY ENGINEERING CO., LTD., Tokyo, JP;

Attorney:

Global IP Counselors, LLP

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/60 (2006.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 24/92 (2013.01); H01L 21/60 (2021.08); H01L 21/67103 (2013.01); H01L 21/67115 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 24/81 (2013.01); H01L 24/98 (2013.01); H01L 33/0093 (2020.05); H01L 21/6838 (2013.01); H01L 24/75 (2013.01); H01L 33/32 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20105 (2013.01);
Abstract

A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

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