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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12341036 B1

PDFFull Text
Date of Patent:
Jun. 24, 2025

Filed:

Jan. 20, 2023

Resin shaping device

Applicant:

Bondtech Co., Ltd., Kyoto, JP;

Inventor:

Akira Yamauchi, Kyoto, JP;

Assignee:

BONDTECH CO., LTD., Kyoto, JP;

Attorney:

ASLAN LAW, P.C.

Primary Examiner:

Minh N Trinh

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B29C 35/08 (2006.01); B29C 45/14 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H05K 13/04 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); B29C 35/0805 (2013.01); B29C 45/14065 (2013.01); B29C 45/14655 (2013.01); H01L 21/02057 (2013.01); H01L 21/565 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67098 (2013.01); H01L 21/6715 (2013.01); H01L 21/67259 (2013.01); H01L 21/67742 (2013.01); H01L 21/681 (2013.01); H01L 21/6838 (2013.01); H01L 22/12 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H05K 13/0413 (2013.01); B29C 2035/0827 (2013.01); B29L 2031/3406 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75843 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81908 (2013.01); H05K 13/0409 (2018.08);
Abstract

A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.

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