Bondtech Co., Ltd.

Toray Engineering Company, Limited

Kabushiki Kaisha Toshiba

Other

Toshiba Electronic Devices & Storage Corporation

Lan Technical Service Co., Ltd.

Sony Corporation

Fujitsu Corporation

Matsushita Electric Industrial Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Rohm Co., Ltd.

Oki Electric Industry Co., Ltd.

Renesas Technology Corp.

Taiyo Yuden Co., Ltd.

Tadatomo Suga

Akira Yamauchi

Hiroyuki Tsurumi

Yoshiyuki Arai

Hideki Mimura

Shuichi Hisatomi

Fumio Izawa

Mikio Kakizaki

Takaaki Suyama

Tomoko Ono

Yoshiie Matsumoto

Ryuichi Kondou

Katsumi Terada

Mikio Kawakami

Toshihiro Mori

Hiroshi Yoshino

Chisa Inaka

Toshikazu Fujii

Toshihiro Ito

Takashi Hare

Yosuke Sagami

Eiji Shamoto

Toshimichi Moriwaki

Satoru Naraba

A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activation treatment step, exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time, and a bonding step of bonding the two substrates that have the bonding surfaces activated in the activation treatment step.

Substrate bonding method and substrate bonding system

Bonding system for bonding a second article to a first article, comprising an activation treatment device that comprises an object supporter that supports objects comprising the second article, and a particle beam source that activates a bonding surface of the second article by irradiating the objects with a particle beam, the objects being set on one treatment surface without being opposed to each other, followed by performing activation treatment by the particle beam source; and a bond device that brings the second article, of which the bonding surface is activated by the activation treatment device, into contact with the first article, to thereby bond the second article to the first article, wherein the object supporter supports the objects in a posture in which a portion formed of a plurality of kinds of materials comprising the bonding surface of the second article in the objects is exposed to the particle beam source.

Bonding system and bonding method

According to an embodiment, there is provided an amplifier circuit including a first capacitive element, a first GM amplifier, and a second GM amplifier. The first GM amplifier includes a first input node, a second input node, and an output node. The output node is connected to one end of the first capacitive element. The second GM amplifier includes a first input node, a second input node, and an output node. The output node is connected to one end of the first capacitive element and the second input node.

Amplifier circuit and sensor circuit

A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.

Resin shaping device

According to one embodiment, a power amplifying device includes a first amplifier configured to output a first output signal, a second amplifier configured to output a second output signal, a first circuit configured to output a third signal obtained by limiting a magnitude of a voltage value of the first output signal and a fourth signal obtained by limiting a magnitude of a voltage value of the second output signal, and a second circuit configured to transmit an average value of a voltage value of the third signal and a voltage value of the fourth signal, as a first feedback voltage to the first amplifier and the second amplifier.

Power amplifying device

Bonding system that bonds each of a plurality of second articles to a first article, wherein each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article, the bonding system comprises: a device for supplying a second article that supplies the plurality of second articles; a bond device that bonds the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article; and a device for transporting a second article that transports, to the bond device, at least one of the plurality of second articles supplied from the device for supplying a second article, and the device for transporting a second article comprises a holder for holding a second article that holds the uneven portion of the at least one second article.

This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices. The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.

Component mounting system and component mounting method

This substrate bonding device () includes: a stage (), a head (), an electrostatic chuck that holds a peripheral portion of a substrate () while the stage () supports the substrate (), a holder driver that drives the electrostatic chuck, and a controller (). The electrostatic chuck is disposed in a first area on the stage () facing the peripheral portion of the substrate (), and the holder driver drives the electrostatic chuck by applying voltage to the electrostatic chuck. The controller () controls the holder driver in such a manner that a peripheral portion of the substrate () is released from the electrostatic chuck when a peripheral portion of the substrate () is made to come into contact with a peripheral portion of the substrate () while a central portion of a bonding surface of the substrate () and a central portion of a bonding surface of the substrate () are in contact with each other.

Substrate bonding device

The substrate joining method is a substrate joining method for joying two substrates, including a hydrophilic treatment step of hydrophilizing at least one of respective joint surfaces of the two substrates that are to be joined to each other and a joining step of joining the two substrates after the hydrophilic treatment step. The hydrophilic treatment step includes a step of performing a NRIE treatment to perform reactive ion etching using Ngas on the joint surfaces of the substrates and a step of performing a Nradical treatment to irradiate the joint surfaces of the substrates with Nradicals after the step of performing the NRIE treatment.

Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device

A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

Component mounting system

A power amplifying device according to an embodiment includes three or more BTL amplifiers and a closed loop section. The three or more BTL amplifiers include bridge-connected first and second output amplifiers and output a first output signal obtained by amplifying a first input signal. Switch circuits respectively corresponding to the three or more BTL amplifiers are connected in series in the closed loop section. The closed loop section is capable of forming a closed loop. An output terminal of the second output amplifier is connected to one end of the switch circuit corresponding to the second output amplifier. The switch circuit is turned on to establish connection between an output terminal of the first output amplifier and the output terminal of the second output amplifier and is turned off to break the connection between the output terminals.

Power amplifying device and audio system

A power amplifying device according to an embodiment includes first to fourth BTL amplifiers and first to third switch circuits. The first to fourth BTL amplifiers outputs a first to fourth output signal. The first switch circuit is turned on or off connection between an output of the second output amplifier and an output of the third output amplifier. The second switch circuit is turned on or off connection between an output of the fifth output amplifier and an output of the eighth output amplifier. The third switch circuit is turned on or off connection between an output of the fourth output amplifier and an output of the seventh output amplifier. The first to third switch circuits are turned on when the amplitudes of the first to fourth input signals are smaller than a first threshold.

Power amplifying device and audio equipment

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

Method for bonding substrates together, and substrate bonding device

A PWM modulator according to an embodiment includes a first comparator configured to compare a first input signal with a first carrier and output a comparison result, a second comparator configured to compare a second input signal with a second carrier and output a comparison result, and a selector configured to output the comparison result while switching between the comparison result of the first comparator and the comparison result of the second comparator in a cycle according to a cycle of the first or the second carrier.

PWM modulator

A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.

Growing community of inventors

Shiga, Japan

Akira Yamauchi