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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10580752 B1

PDFFull Text
Date of Patent:
Mar. 03, 2020

Filed:

Oct. 19, 2015

Method for bonding substrates together, and substrate bonding device

Applicant:

Bondtech Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventor:

Akira Yamauchi, Kyoto, JP;

Assignee:

BONDTECH CO., LTD., Kyoto, JP;

Attorney:

Aslan Law, P.C.

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Joshel Rivera

Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01L 23/00 (2006.01); H01L 21/68 (2006.01); B23K 20/24 (2006.01); B23K 37/047 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/18 (2006.01); H01L 23/544 (2006.01); B23K 20/233 (2006.01); B23K 37/04 (2006.01); B23K 20/02 (2006.01); H01L 21/683 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 20/023 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); B23K 37/047 (2013.01); B23K 37/0408 (2013.01); H01L 21/187 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/68 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 24/80 (2013.01); H01L 24/94 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); H01L 2223/54426 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/757 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7592 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75272 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/75305 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75705 (2013.01); H01L 2224/75724 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/8003 (2013.01); H01L 2224/8009 (2013.01); H01L 2224/80012 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/80047 (2013.01); H01L 2224/80132 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80213 (2013.01); H01L 2224/80893 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80907 (2013.01); H01L 2224/80908 (2013.01); H01L 2224/80986 (2013.01); H01L 2224/83009 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83896 (2013.01); H01L 2224/83908 (2013.01); H01L 2224/94 (2013.01);
Abstract

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

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