The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Jul. 02, 2019
Bondtech Co., Ltd., Kyoto, JP;
Akira Yamauchi, Kyoto, JP;
BONDTECH CO., LTD., Kyoto, JP;
Abstract
This substrate bonding device () includes: a stage (), a head (), an electrostatic chuck that holds a peripheral portion of a substrate () while the stage () supports the substrate (), a holder driver that drives the electrostatic chuck, and a controller (). The electrostatic chuck is disposed in a first area on the stage () facing the peripheral portion of the substrate (), and the holder driver drives the electrostatic chuck by applying voltage to the electrostatic chuck. The controller () controls the holder driver in such a manner that a peripheral portion of the substrate () is released from the electrostatic chuck when a peripheral portion of the substrate () is made to come into contact with a peripheral portion of the substrate () while a central portion of a bonding surface of the substrate () and a central portion of a bonding surface of the substrate () are in contact with each other.