The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2025

Filed:

Nov. 15, 2018
Applicant:

Bondtech Co., Ltd., Kyoto, JP;

Inventor:

Akira Yamauchi, Kyoto, JP;

Assignee:

BONDTECH CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/67259 (2013.01); H01L 24/75 (2013.01); H01L 21/67017 (2013.01); H01L 21/68707 (2013.01); H01L 2224/75753 (2013.01);
Abstract

This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices. The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.


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