The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Apr. 24, 2015
Tadatomo Suga, Tokyo, JP;
Bondtech Co., Ltd., Kyoto-shi, Kyoto, JP;
Tadatomo Suga, Tokyo, JP;
Akira Yamauchi, Kyoto, JP;
Other;
BONDTECH CO., LTD., , JP;
Abstract
A substrate bonding apparatus () includes a vacuum chamber (), a surface activation part () for activating respective bonding surfaces of a first substrate () and a second substrate (), and stage moving mechanisms () for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (). In order to activate the bonding surfaces in the vacuum chamber (), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates ().