Trademarks = 2

Forward Citations = 22

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2 inventors (with patents filed for the assignee):

Masuaki Okada (4 out of 4 patents)

Tadatomo Suga (3 out of 26 patents)

4 patents: Sort by Forward Citations

1. 8651363 - Joining method and device produced by this method and joining unit (2014-02-18),

2. 8091764 - Joining method and device produced by this method and joining unit (2012-01-10),

3. 7784670 - Joining method and device produced by this method and joining unit (2010-08-31),

4. 7645681 - Bonding method, device produced by this method, and bonding device (2010-01-12),

Bondtech, Inc. is a leading provider of innovative industrial adhesive solutions. With over 30 years of experience, we specialize in developing and manufacturing high-performance adhesive products for a wide range of industries, including automotive, construction, packaging, and more. Our products are known for their durability, reliability, and versatility, making them ideal for various bonding applications. Visit our website to learn more about our products and services.

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Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

4 Patents

#165 in Kyoto

#7,421 in Japan

Kyoto, Japan

Bondtech, Inc.

Forward Citations = 22

2 inventors:

Masuaki Okada (4 out of 4 patents)

Tadatomo Suga (3 out of 26 patents)

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