Trademarks = 2

Forward Citations = 23

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3 inventors (with patents filed for the assignee):

Masuaki Okada (4 out of 4 patents)

Tadatomo Suga (3 out of 26 patents)

Akira Yamauchi (3 out of 3 patents)

7 patents: Sort by Forward Citations

1. 12721104 - Chip bonding system and chip bonding method (2026-08-25),

2. 12696799 - Bonding method, bonded article, and bonding device (2026-07-28),

3. 12660566 - Bonding method, substrate bonding device, and substrate bonding system (2026-06-16),

4. 8651363 - Joining method and device produced by this method and joining unit (2014-02-18),

5. 8091764 - Joining method and device produced by this method and joining unit (2012-01-10),

6. 7784670 - Joining method and device produced by this method and joining unit (2010-08-31),

7. 7645681 - Bonding method, device produced by this method, and bonding device (2010-01-12),

Company Overview

Bondtech, Inc. is a leading provider of innovative industrial adhesive solutions. With over 30 years of experience, we specialize in developing and manufacturing high-performance adhesive products for a wide range of industries, including automotive, construction, packaging, and more. Our products are known for their durability, reliability, and versatility, making them ideal for various bonding applications. Visit our website to learn more about our products and services.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

7 Patents

#141 in Kyoto

#5,459 in Japan

Kyoto, Japan

Bondtech, Inc.

Forward Citations = 23

3 inventors:

Masuaki Okada (4 out of 4 patents)

Tadatomo Suga (3 out of 26 patents)

Akira Yamauchi (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Bondtech, Inc.. Retrieved from https://idiyas.com/company/bondtech

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]