The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Feb. 24, 2022
Bondtech Co., Ltd., Kyoto, JP;
Akira Yamauchi, Kyoto, JP;
BONDTECH CO., LTD., Kyoto, JP;
Abstract
A bonding method includes a substrate holding step of holding substrates (W, W), a first contact step of bringing central portions of the substrates (W, W) into contact with each other, a second contact step of, enlarging a contact area between the substrates (W, W) from central portions toward peripheral portions of the substrates (W, W), and a bonding step of, bonding the substrates (W, W) to each other by pressing only a peripheral portion of the substrate (W) against a peripheral portion of the substrate (W) while the substrates (W, W) are in contact with each other over entire bonding surfaces.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile