The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Jul. 29, 2021
Bondtech Co., Ltd., Kyoto, JP;
Akira Yamauchi, Kyoto, JP;
BONDTECH CO., LTD., Kyoto, JP;
Abstract
A chip bonding system () includes a dicing device () to, by dicing a dicing substrate stuck on a sheet (TE), generate a plurality of chips (CP) stuck on the sheet (TE) with chips (CP) adjacent to each other joined to each other via remaining uncut portions, an activation treatment device () to activate bonding surfaces of respective ones of the chips (CP) stuck to the sheet (TE), a sheet stretching device () to, by stretching the sheet (TE) on which the chips (CP) having bonding surfaces activated by the activation treatment device () are stuck, brings the chips (CP) into a state of being separated from one another, and a bonding device () to, by bringing one chip (CP) picked out of the chips (CP) separated from one another into contact with a substrate (WT), bond the one chip (CP) to the substrate (WT).
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile