Masuaki Okada

Title: Masuaki Okada: Innovator in Bonding Technology

Introduction

Masuaki Okada is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of bonding technology, holding a total of four patents. His innovative approaches have paved the way for advancements in solid-phase room-temperature bonding techniques.

Latest Patents

One of Okada's latest patents focuses on a joining method and device that enables solid-phase room-temperature bonding without the need for a profile irregularity of several nanometers. This method eliminates the requirement for high-vacuum energy wave treatment and continuous high-vacuum bonding. The technique involves a thin adhering substance layer that is activated using an energy wave. By crushing this layer, a new surface is created on the bonding interface, allowing objects to be bonded together effectively. The bonding metal used in this process is required to have a low hardness, specifically a Vickers hardness of 200 Hv or less, which has been found to be particularly effective for room-temperature bonding.

Career Highlights

Throughout his career, Masuaki Okada has worked with various companies, including Bondtech, Inc. His work has been instrumental in developing practical bonding techniques that enhance the efficiency and effectiveness of bonding processes.

Collaborations

Okada has collaborated with Tadatomo Suga, contributing to the advancement of bonding technologies through their combined expertise.

Conclusion

Masuaki Okada's innovative work in bonding technology has led to significant advancements in the field. His patents reflect a deep understanding of materials and bonding processes, making him a key figure in this area of innovation.