The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Nov. 24, 2019
Applicants:
Isabers Japan Co. Ltd., Tokyo, JP;
Tadatomo Suga, Tokyo, JP;
Inventors:
Tadatomo Suga, Tokyo, JP;
Yoshiie Matsumoto, Tokyo, JP;
Assignees:
Tadatomo SUGA, Tokyo, JP;
iSABers Japan Co. Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 27/04 (2005.12); B32B 17/06 (2005.12); C03C 17/245 (2005.12); C03C 27/10 (2005.12); C23C 14/08 (2005.12); C23C 14/46 (2005.12); C23C 14/58 (2005.12); H10K 71/50 (2022.12);
U.S. Cl.
CPC ...
C03C 27/042 (2012.12); B32B 17/06 (2012.12); C03C 17/245 (2012.12); C03C 27/10 (2012.12); C23C 14/081 (2012.12); C23C 14/46 (2012.12); C23C 14/5833 (2012.12); H10K 71/50 (2023.01); C03C 2217/214 (2012.12); C03C 2218/154 (2012.12);
Abstract
A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.