The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jan. 30, 2012
Applicants:

Tadatomo Suga, Tokyo, JP;

Akira Yamauchi, Kyoto, JP;

Ryuichi Kondou, Tokyo, JP;

Yoshiie Matsumoto, Tokyo, JP;

Inventors:

Tadatomo Suga, Tokyo, JP;

Akira Yamauchi, Kyoto, JP;

Ryuichi Kondou, Tokyo, JP;

Yoshiie Matsumoto, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); B32B 38/08 (2006.01); B23K 1/20 (2006.01); B23K 20/24 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01); H01L 21/302 (2006.01); H01L 21/02 (2006.01); H01L 23/525 (2006.01); B32B 7/04 (2006.01); H01J 37/317 (2006.01); B23K 101/36 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
B32B 38/08 (2013.01); B23K 1/20 (2013.01); B23K 20/24 (2013.01); B32B 7/04 (2013.01); H01J 37/317 (2013.01); H01L 21/02046 (2013.01); H01L 21/2007 (2013.01); H01L 21/302 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/76251 (2013.01); H01L 23/5252 (2013.01); B23K 2201/36 (2013.01); H01J 2237/08 (2013.01); H01J 2237/202 (2013.01); H01J 2237/3165 (2013.01); H01L 23/147 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/265 (2015.01); Y10T 428/31678 (2015.04);
Abstract

[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.


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