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For the Inventor, By the Inventor

Zhubei, Taiwan

Su-Jen Sung

This inventor holds 30 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., United Microelectronics Corp.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Su-Jen Sung. Retrieved from https://idiyas.com/inventor/su-jen-sung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 93.3

Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 42(Granted Patents)


Location History:

  • Hsin-Chu Hsien, TW (2011)
  • Hsinchu County, TW (2011 - 2023)
  • Zhubei, TW (2015 - 2024)

Company Filing History:

goldMedal26 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 7,278 
 
United Microelectronics Corp.
 patents

Years Active: 2011-2026

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Areas of Expertise:
Interconnect Structure
Electro-Migration Barrier
Wafer Protection
Multi-Layer Etch Stop
Nitrogen Plasma Treatment
Capping Layer
Porous Low-K Layer
Dual Damascene Opening
Deposition Chamber
Integrated Circuit
Semiconductor Device
30 patents (USPTO):Explore Patents
1. 12550706 - Interconnect structure and method of forming same (2026-02-10),
2. 12255095 - Semiconductor structure and manufacturing method thereof (2025-03-18),
3. 12211766 - Highly protective wafer edge sidewall protection layer (2025-01-28),
4. 12198979 - Semiconductor device with multi-layer etch stop structure (2025-01-14),
5. 12159830 - Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect (2024-12-03),
6. 12094930 - Integrated circuit structure and method for forming the same (2024-09-17),
7. 12046557 - Interconnect structure and method of forming same (2024-07-23),
8. 11923304 - Electro-migration barrier for interconnect (2024-03-05),
9. 11848231 - Method for forming semiconductor device with multi-layer etch stop structure (2023-12-19),
10. 11670546 - Semiconductor structure and manufacturing method thereof (2023-06-06),
11. 11532548 - Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect (2022-12-20),
12. 11515255 - Electro-migration barrier for interconnect (2022-11-29),
13. 11502035 - Interconnect structure and method of forming same (2022-11-15),
14. 11282742 - Semiconductor device with multi-layer etch stop structure and method for forming the same (2022-03-22),
15. 11264328 - Capping layer for improved deposition selectivity (2022-03-01),

Title: Inventor Su-Jen Sung: Revolutionizing Technology in Zhubei

Introduction: Su-Jen Sung is a pioneering inventor based in Zhubei, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Su-Jen Sung holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a career spanning over two decades, Su-Jen Sung has worked tirelessly to develop cutting-edge solutions that have significantly impacted various industries. Her innovative spirit and dedication to excellence have earned her recognition as a leading figure in the tech world.

Collaborations: Throughout her career, Su-Jen Sung has collaborated with top research institutions, universities, and tech companies to bring her inventions to life. Her ability to work seamlessly in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Su-Jen Sung's passion for innovation and her relentless drive to push the boundaries of technology continue to inspire the next generation of inventors. Her work serves as a testament to the power of creativity and perseverance in shaping a better tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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