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For the Inventor, By the Inventor

Santa Clara, CA, United States of America

Siew Neo

This inventor holds 20 USPTO granted patents and 1 published patent application, primarily in Chemical Mechanical Polishing. Top assignee: Applied Materials, Inc.. Active years: 2004-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Siew Neo. Retrieved from https://idiyas.com/inventor/siew-neo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 20.0

Average Co-Inventor Count = 6.6

ph-index = 10

Forward Citations = 337(Granted Patents)


Company Filing History:

goldMedal20 out of 14,502 
 
Applied Materials, Inc.
 patents

Years Active: 2004-2011

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Areas of Expertise:
Chemical Mechanical Polishing
Electrochemical Processing
Polishing Pad
Real-Time Control
Electrolyte Composition
Surface Finish
Endpoint Detection
Substrate Polishing
Removal Profile
Planarization
Hydrogen Bubble Reduction
20 patents (USPTO):Explore Patents
1. 8066552 - Multi-layer polishing pad for low-pressure polishing (2011-11-29),
2. 7790015 - Endpoint for electroprocessing (2010-09-07),
3. 7678245 - Method and apparatus for electrochemical mechanical processing (2010-03-16),
4. 7628905 - Algorithm for real-time process control of electro-polishing (2009-12-08),
5. 7422516 - Conductive polishing article for electrochemical mechanical polishing (2008-09-09),
6. 7384534 - Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP (2008-06-10),
7. 7278911 - Conductive polishing article for electrochemical mechanical polishing (2007-10-09),
8. 7232514 - Method and composition for polishing a substrate (2007-06-19),
9. 7229535 - Hydrogen bubble reduction on the cathode using double-cell designs (2007-06-12),
10. 7207878 - Conductive polishing article for electrochemical mechanical polishing (2007-04-24),
11. 7160432 - Method and composition for polishing a substrate (2007-01-09),
12. 7128825 - Method and composition for polishing a substrate (2006-10-31),
13. 7112270 - Algorithm for real-time process control of electro-polishing (2006-09-26),
14. 6991528 - Conductive polishing article for electrochemical mechanical polishing (2006-01-31),
15. 6991526 - Control of removal profile in electrochemically assisted CMP (2006-01-31),

Title: Inventor Siew Neo: Pioneering Innovations in Santa Clara

Introduction: Siew Neo is a visionary inventor based in Santa Clara, CA, known for his groundbreaking contributions to the field of technology and beyond.

Latest Patents: Siew Neo holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Siew Neo has worked with leading tech companies in Silicon Valley, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Siew Neo has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and excellence in all his endeavors.

Conclusion: Siew Neo's passion for innovation, coupled with his relentless drive to make a positive impact on the world, solidifies his position as a trailblazing inventor in Santa Clara and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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