The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2007

Filed:

Jun. 26, 2003
Applicants:

Feng Q. Liu, San Jose, CA (US);

Liang-yuh Chen, Foster City, CA (US);

Stan D. Tsai, Fremont, CA (US);

Alain Duboust, Sunnyvale, CA (US);

Siew S. Neo, Santa Clara, CA (US);

Yongqi HU, Campbell, CA (US);

Yan Wang, Sunnyvale, CA (US);

Paul D. Butterfield, San Jose, CA (US);

Inventors:

Feng Q. Liu, San Jose, CA (US);

Liang-Yuh Chen, Foster City, CA (US);

Stan D. Tsai, Fremont, CA (US);

Alain Duboust, Sunnyvale, CA (US);

Siew S. Neo, Santa Clara, CA (US);

Yongqi Hu, Campbell, CA (US);

Yan Wang, Sunnyvale, CA (US);

Paul D. Butterfield, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23H 5/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.


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