Campbell, CA, United States of America

Yongqi Hu

USPTO Granted Patents = 35 


Average Co-Inventor Count = 5.3

ph-index = 8

Forward Citations = 197(Granted Patents)


Location History:

  • Campbell, CA (US) (2005 - 2009)
  • San Jose, CA (US) (2006 - 2010)
  • Santa Clara, CA (US) (2004 - 2019)
  • Fremont, CA (US) (2015 - 2023)

Company Filing History:


Years Active: 2004-2025

where 'Filed Patents' based on already Granted Patents

35 patents (USPTO):

Title: **Yongqi Hu: A Pioneer in Polishing Pad Innovations**

Introduction

Yongqi Hu, based in Campbell, California, is an accomplished inventor with an impressive portfolio of 34 patents. His work primarily focuses on innovations in the field of polishing pad technology, aiming to enhance the efficiency and effectiveness of polishing processes in various applications.

Latest Patents

Among Yongqi Hu's latest inventions are two notable patents that showcase his ingenuity. The first patent describes a "Window in Thin Polishing Pad," which features a polishing layer stack with a unique aperture design that allows for improved fluid dynamics and light transmission. This innovative polishing pad incorporates a fluid-impermeable layer and an adhesive system to ensure the durability and functionality of the product.

The second patent, titled "Polishing Pad with Secondary Window Seal," presents a polishing article equipped with a dual-section aperture and an inwardly extending projection. This design not only secures a window in place but also enhances the adhesion between components, contributing to a more reliable polishing experience.

Career Highlights

Yongqi Hu’s professional journey includes significant contributions as a key inventor at Applied Materials, Inc. His extensive knowledge and innovative spirit have led him to develop groundbreaking technologies that improve the performance of semiconductor manufacturing processes through enhanced polishing applications.

Collaborations

Throughout his career, Yongqi has collaborated with several talented individuals, including Liang-Yuh Chen and Stan D. Tsai. These partnerships have fostered creative synergy, allowing for the development of advanced technologies that address complex industry challenges.

Conclusion

Yongqi Hu stands out as a leading figure in polishing pad technology, with a remarkable number of patents that reflect his commitment to innovation. His contributions not only advance the capabilities of the industry but also pave the way for future discoveries in materials science and engineering. As he continues to push the boundaries of what is possible, Yongqi's work will undoubtedly have a lasting impact on the field.

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