The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2009
Filed:
May. 05, 2005
Zhihong Wang, Santa Clara, CA (US);
You Wang, Cupertino, CA (US);
Daxin Mao, Cupertino, CA (US);
Renhe Jia, Berkeley, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi HU, San Jose, CA (US);
Yuan A. Tian, San Jose, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Zhihong Wang, Santa Clara, CA (US);
You Wang, Cupertino, CA (US);
Daxin Mao, Cupertino, CA (US);
Renhe Jia, Berkeley, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi Hu, San Jose, CA (US);
Yuan A. Tian, San Jose, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.