The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2010
Filed:
Jun. 30, 2004
Yan Wang, Sunnyvale, CA (US);
Siew Neo, Santa Clara, CA (US);
Feng Liu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi HU, San Jose, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Antoine Manens, Palo Alto, CA (US);
Ralph M. Wadensweiler, Sunnyvale, CA (US);
Rashid Mavliev, Santa Clara, CA (US);
Liang-yuh Chen, Foster City, CA (US);
Donald J. K. Olgado, Palo Alto, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Ming-kuei Tseng, San Jose, CA (US);
Shou-sung Chang, Stanford, CA (US);
Lizhong Sun, Sunnyvale, CA (US);
Yan Wang, Sunnyvale, CA (US);
Siew Neo, Santa Clara, CA (US);
Feng Liu, San Jose, CA (US);
Stan D. Tsai, Fremont, CA (US);
Yongqi Hu, San Jose, CA (US);
Alain Duboust, Sunnyvale, CA (US);
Antoine Manens, Palo Alto, CA (US);
Ralph M. Wadensweiler, Sunnyvale, CA (US);
Rashid Mavliev, Santa Clara, CA (US);
Liang-Yuh Chen, Foster City, CA (US);
Donald J. K. Olgado, Palo Alto, CA (US);
Paul D. Butterfield, San Jose, CA (US);
Ming-Kuei Tseng, San Jose, CA (US);
Shou-Sung Chang, Stanford, CA (US);
Lizhong Sun, Sunnyvale, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.