This inventor holds 53 USPTO granted patents and 10 published patent applications, primarily in Chemical Mechanical Polishing (CPC class B24B). Top assignees: Applied Materials, Inc., R & a Acoustical Structures, Other. Active years: 1996-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
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1 out of 834,513 Years Active: 1996-2026
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Title: The Innovations of Paul D. Butterfield in Chemical Mechanical Polishing
Introduction: Paul D. Butterfield, an accomplished inventor based in San Jose, CA, has made significant contributions to the field of chemical mechanical polishing (CMP) with a remarkable portfolio of 50 patents. His innovative approaches in this specialized domain showcase his expertise and commitment to advancing technology in the industry.
Latest Patents: Among his latest inventions are two notable patents. The first, titled "Steam Treatment Stations for Chemical Mechanical Polishing System," describes an apparatus designed for the steam treatment of conditioner heads and disks utilized in CMP systems. This invention features a conditioner cleaning cup, a boiler for steam generation, strategically positioned nozzles, and a supply line to deliver steam precisely where it's needed. The second patent, "Slurry Distribution Device for Chemical Mechanical Polishing," presents a sophisticated apparatus that enhances the process of chemical mechanical polishing. It includes a rotatable platen with a polishing pad, a carrier head for substrate contact, and an advanced polishing liquid distribution system that ensures an even distribution of polishing liquid over the pad.
Career Highlights: Paul D. Butterfield has been employed at Applied Materials, Inc., where he has further honed his skills and expanded his contributions to the technology sector. His role in developing innovative solutions at this leading company underscores his impact in the field of materials processing.
Collaborations: Throughout his career, Butterfield has worked alongside distinguished colleagues, including Shou-Sung Chang and Liang-Yuh Chen. Their collaborations have likely fostered a dynamic exchange of ideas, furthering advancements in their shared field.
Conclusion: Paul D. Butterfield exemplifies the spirit of innovation and invention in the realm of chemical mechanical polishing. With a strong portfolio of patents and a collaborative approach, he continues to drive technological advancements that will shape the future of the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile