The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Aug. 26, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yen-Chu Yang, Santa Clara, CA (US);

Stephen Jew, San Jose, CA (US);

Jianshe Tang, San Jose, CA (US);

Haosheng Wu, San Jose, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Paul D. Butterfield, San Jose, CA (US);

Alexander John Fisher, Santa Clara, CA (US);

Bum Jick Kim, Irvine, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/02 (2006.01); B24B 37/10 (2012.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/10 (2013.01); H01L 21/67075 (2013.01); H01L 21/6708 (2013.01);
Abstract

An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.


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