Haosheng Wu

Title: Innovations of Haosheng Wu: Pioneering Contributions in Chemical Mechanical Polishing

Introduction

Haosheng Wu, based in Santa Clara, CA, is a distinguished inventor with an impressive portfolio of 19 patents. His inventions primarily focus on advancements in chemical mechanical polishing, contributing significantly to the technology used in substrate processing.

Latest Patents

One of Haosheng Wu's latest patents is titled "Temperature Control of Chemical Mechanical Polishing." This innovative chemical mechanical polishing system includes a support for holding a polishing pad and a carrier head to press a substrate against the pad during the polishing process. The system features an in-situ monitoring system that generates a signal to indicate the material amount on the substrate. Additionally, it incorporates a temperature control system to manage the polishing temperature, with a controller that adjusts the temperature based on feedback from the monitoring system.

Another notable patent is the "Steam-Assisted Single Substrate Cleaning Process and Apparatus." This method revolves around rotating a substrate on a support while spraying the front side with steam through a dedicated nozzle assembly. Concurrently, the backside of the substrate is cleaned using steam dispensed through a secondary assembly. The patent also includes the dispensing of a heated chemical over the front side to enhance the cleaning process.

Career Highlights

Haosheng Wu has demonstrated his expertise through his roles at reputable organizations like Applied Materials, Inc. and Carnegie Mellon University. His contributions in these positions have played a crucial role in advancing polishing and cleaning technologies within the semiconductor industry.

Collaborations

Throughout his career, Wu has collaborated with notable peers such as Shou-Sung Chang and Jianshe Tang. These partnerships have further strengthened his innovative approach and have contributed to the success of his projects.

Conclusion

Haosheng Wu stands out as a prominent inventor whose work in chemical mechanical polishing has yielded vital patents that enhance substrate processing techniques. His continuous innovation in this field exemplifies his commitment to advancing technology and supporting the future of semiconductor manufacturing.