The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Oct. 26, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chad Pollard, San Jose, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Haosheng Wu, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/02 (2006.01); B24B 53/017 (2012.01); F16L 11/127 (2006.01); H01L 21/67 (2006.01); H01R 13/52 (2006.01); H01R 13/622 (2006.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 53/017 (2013.01); F16L 11/127 (2013.01); H01L 21/67017 (2013.01); H01R 13/5205 (2013.01); H01R 13/622 (2013.01);
Abstract

A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.


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