The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

Mar. 09, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kun Xu, Sunol, CA (US);

Patrick A. Higashi, Hacienda Heights, CA (US);

Hassan G. Iravani, Sunnyvale, CA (US);

Harry Q. Lee, Los Altos, CA (US);

Haosheng Wu, San Jose, CA (US);

Eric T. Wu, Milpitas, CA (US);

Ningzhuo Cui, Santa Clara, CA (US);

Jeonghoon Oh, Saratoga, CA (US);

Christopher Lai, Santa Clara, CA (US);

Jun Qian, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/10 (2006.01); B24B 37/005 (2012.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 49/105 (2013.01); B24B 37/005 (2013.01); B24B 37/26 (2013.01);
Abstract

A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.


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