Company Filing History:
Years Active: 2013-2025
Title: Innovations of Ningzhuo Cui in Polishing Technology
Introduction
Ningzhuo Cui is an accomplished inventor based in Santa Clara, CA, known for his contributions to polishing technology. With a total of two patents to his name, Cui has made significant advancements in the field, particularly in the area of vibration detection during polishing processes.
Latest Patents
Cui's latest patents include innovative methods and systems designed to enhance the efficiency and effectiveness of polishing. One of his notable inventions is the "Eddy current monitoring to detect vibration in polishing." This patent describes a system where a body is brought into contact with a polishing pad, and a polishing liquid is supplied. The invention utilizes an in-situ eddy current monitoring system to detect mechanical vibrations during the polishing process, ensuring optimal performance. Another significant patent is the "Polishing pad and system with window support." This invention features a polishing pad equipped with a solid light-transmissive window and an optical fiber, allowing for improved monitoring and control during polishing operations.
Career Highlights
Ningzhuo Cui is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His work at Applied Materials has allowed him to focus on developing cutting-edge technologies that address the challenges faced in polishing processes.
Collaborations
Cui has collaborated with several talented individuals in his field, including Jun Qian and Dominic J Benvegnu. These collaborations have contributed to the advancement of polishing technologies and have fostered a creative environment for innovation.
Conclusion
Ningzhuo Cui's contributions to polishing technology through his patents and work at Applied Materials, Inc. highlight his role as a significant inventor in the industry. His innovative approaches to vibration detection and polishing systems continue to influence advancements in the field.
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